Semiconductors
Samsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes through 2027, including a process technology with a backside power delivery, re-emphasizing plans to bring out a 1.4nm-class node in 2027, and the introduction of a 'high value' 4nm-class manufacturing tech. Samsung Foundry's key announcements for today are clearly focused on the its 2nm-class process technologies, which are set to enter production in 2025 and will span to 2027, when the company's 1.4-nm class production node is set to enter the scene. Samsung is also adding (or rather, renaming) another 2nm-class node to their roadmap with SF2, which was previously disclosed by Samsung as SF3P and...
SK Hynix Set to Build a New Memory Fab
SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...
16 by Anton Shilov on 7/30/2018
Intel Provides Royalty-Free License for Data Bus to DARPA’s Modular Chips Initiative
Taking place this week is DARPA’s 2018 Electronic Resurgence Initiative (ERI) Summit, the defense research agency's first gathering to address the direction of US technology manufacturing as Moore's Law...
14 by Anton Shilov on 7/25/2018
GlobalFoundries Announces 22FDX Milestone: $2 Billion in Design Wins
GlobalFoundries on Monday announced a milestone concerning its 22FDX-branded fully-depleted SOI low-power planar transistor platform. The company initiated volume production using the technology with yields and performance meeting expectations...
13 by Anton Shilov on 7/10/2018
Arm and Samsung Extend Artisan POP IP Collaboration to 7LPP and 5LPE Nodes
Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. Under the terms of the agreement, Arm will offer Samsung Foundry...
23 by Anton Shilov on 7/6/2018
UMC Acquires Fujitsu’s Stake in Semiconductor Joint Venture
Fujitsu Semiconductor and UMC on Friday said that the latter will acquire 100% ownership of Mie Fujitsu Semiconductor (MIFS), a joint venture between two companies. The move essentially ends...
2 by Anton Shilov on 6/29/2018
Samsung to Pay $400 Million for Infringing FinFET Patent
A federal jury in Texas ordered Samsung Electronics to pay $400 million to a South Korean university for infringing one of fundamental patents related to double gate FinFET transistors...
33 by Anton Shilov on 6/19/2018
GlobalFoundries Gives 7 nm Capacity Update, Mulls Skipping 5 nm
High-ranking executives of GlobalFoundries this month gave several updates concerning future plans of the contract maker of semiconductors. As it appears, in a bid to provide more tangible advantages...
19 by Anton Shilov on 5/31/2018
Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming
Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...
25 by Anton Shilov on 5/24/2018
Intel Discloses Plans to Spend $5 Billion on Fab 28 Expansion in Israel
Intel and two Israeli ministries this week announced that the chip giant plans to invest $5 billion in its Kiryat Gat fab complex – Fab 28 – through 2020...
35 by Anton Shilov on 5/18/2018
TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains
At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the...
10 by Anton Shilov on 5/8/2018
Intel Delays Mass Production of 10 nm CPUs to 2019
Intel on Thursday announced that it would delay mass production of its 10 nm processors from 2018 to 2019 due to yield issues. The company has claimed to be...
156 by Anton Shilov on 4/27/2018
TSMC Kicks Off Volume Production of 7nm Chips
TSMC last week announced that it had started high volume production (HVM) of chips using their first-gen 7 nm (CLN7FF) process technology. The contract maker of semiconductors says it...
63 by Anton Shilov on 4/24/2018
Cadence Announces Tensilica Vision Q6 DSP
Today’s announcement comes from Cadence, and we see the unveiling of a new DSP IP called the new Tensilica Vision Q6. The Q6 succeeds the Vision P6 which as...
20 by Andrei Frumusanu on 4/11/2018
Change of Strategy: A New GlobalFoundries CEO in Dr. Thomas Caulfield
In a surprising move, GlobalFoundries has announced that its CEO is stepping down. Sanjay Jha, who lead the world’s second largest foundry for four years, was in the past...
15 by Anton Shilov on 3/15/2018
Broadcom-Qualcomm Takeover Blocked By White House on National Security Grounds
Stepping into the increasingly wild saga that has been Broadcom’s efforts to purchase Qualcomm, the US government is now weighing in by issuing a new order to block the...
52 by Ryan Smith on 3/12/2018
Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek
Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands, and if unofficial...
16 by Anton Shilov on 3/1/2018
The GlobalFoundries Fab 8 Tour and a Junior Editor's Thoughts
For those who haven’t noticed the anti-contaminant “bunny suit” pictures floating around Twitter, this past weekend Ian and I took part in a tour of GlobalFoundries Fab 8 in...
18 by Nate Oh on 2/8/2018
Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group
Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...
19 by Anton Shilov on 2/2/2018
TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020
TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...
27 by Anton Shilov on 1/31/2018
Samsung Starts Mass Production of Chips Using 10nm Low Power Plus (10LPP) Process Tech
Samsung Foundry on Wednesday revealed that it has started mass production of SoC products using its second generation 10 nm Low Power Plus (10LPP) fabrication technology. The new manufacturing...
10 by Anton Shilov on 11/29/2017
Facebook
Twitter
RSS
