Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...
2 by on 4/23/2024
JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features
When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...
14 by on 4/22/2024
SK Hynix and TSMC Team Up for HBM4 Development
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...
5 by on 4/19/2024
TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises
Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...
11 by on 4/19/2024
ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner
This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...
13 by on 4/18/2024
Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...
6 by on 4/17/2024
Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...
5 by on 4/16/2024
Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs
Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5...
9 by on 4/12/2024
Western Digital Previews 4 TB SD Card: World's Highest-Capacity
Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and...
15 by on 4/11/2024
Intel To Discontinue Boxed 13th Gen Core CPUs for Enthusiasts
In an unexpected move, Intel has announced plans to phase out the boxed versions of its enthusiasts-class 13th Generation Core 'Raptor Lake' processors. According to a product change notification...
5 by on 4/10/2024
Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2
Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...
2 by on 4/10/2024
Google Develops In-House Arm 'Axion' CPU for Datacenters
Google was among the first hyperscalers build custom silicon for its services, starting first with tensor processing units (TPUs) for its AI initiatives, and then video transcoding units (VCUs...
15 by on 4/9/2024
TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...
23 by on 4/8/2024
SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...
7 by on 4/5/2024
PCIe 7.0 Draft 0.5 Spec Available: 512 GB/s over PCIe x16 On Track For 2025
PCI-SIG this week released version 0.5 of the PCI-Express 7.0 specification to its members. This is the second draft of the spec and the final call for PCI-SIG members...
18 by on 4/4/2024
Samsung Unveils CXL Memory Module Box: Up to 16 TB at 60 GB/s
Composable disaggregated data center infrastructure promises to change the way data centers for modern workloads are built. However, to fully realize the potential of new technologies, such as CXL...
17 by on 4/3/2024
Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies
Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...
10 by on 4/2/2024
Introspect Intros GDDR7 Test System For Fast GDDR7 GPU Design Bring Up
Introspect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory...
0 by on 3/29/2024
Western Digital Ships 24TB Red Pro Hard Drive For NASes [UPDATED]
Nowadays highest-capacity hard drives are typically aimed at cloud service providers (CSPs) and enterprises, but this does not mean that creative professionals or regular users do not need them...
18 by on 3/28/2024
HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share
Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...
6 by on 3/28/2024
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